How does a wire bonding machine work?-xmacey.com

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How does a wire bonding machine work?

June 29 , 2023

How does a wire bonding machine work?

A wire bonding machine is used in the semiconductor industry to connect integrated circuits (ICs) or other electronic components to their packaging or substrate. It uses a thin wire, typically made of gold or aluminum, to create electrical connections between different parts of the circuit. Here's a simplified explanation of how a wire bonding machine works:

Wire bonding machine

Loading: The machine starts by loading the substrate or package containing the IC or electronic component onto the work stage. The substrate is typically a ceramic or silicon wafer.

Wire feeding: The wire bonding machine feeds a spool of wire into the system. The wire is typically very thin, ranging from around 15 to 75 micrometers in diameter. The wire is threaded through a series of guides and clamps to ensure proper alignment and tension.

Positioning: The machine positions the bonding tool, which holds the wire, in the correct location over the substrate. The bonding tool consists of a small, wedge-shaped tool or capillary that is capable of holding and manipulating the wire.

Bonding process: The machine controls the position, force, and energy applied during the bonding process. It uses a combination of heat, ultrasonic energy, and pressure to create reliable and durable wire bonds. The parameters can be adjusted based on the wire material, bonding method, and specific requirements of the IC assembly.

First bond: The machine moves the bonding tool to the desired location on the substrate, and the molten ball at the end of the wire is pressed onto a bonding pad or terminal. The combination of heat and pressure creates a solid metallurgical bond between the wire and the pad.

Loop formation: After the first bond is created, the bonding tool moves to create a loop in the wire. The loop is formed to allow for stress relief and accommodate any thermal expansion or contraction that may occur during the operation of the electronic device.

Second bond: The bonding tool moves to another location on the substrate, typically a lead or another bonding pad, and the wire is pressed onto it. Another bond is created using heat and pressure, forming a connection between the wire and the new location.

Wire cutting: Once the second bond is made, the excess wire extending from the second bond is cut using a cutting tool or laser. This ensures that the wire is trimmed to the desired length, leaving a clean and precise connection.

Inspection and quality control: After the wire bonding process is completed, the machine may include an inspection system to check the quality of the bonds. This can involve visual inspection, electrical testing, or other methods to ensure that the bonds meet the required standards.

Repeat: The machine repeats the process for each bond required to complete the circuit or connect the electronic component to its package. The number of bonds and their locations depend on the specific design and requirements of the device.

This is a general overview of the wire bonding process, and the actual operation and complexity of wire bonding machines can vary depending on the specific machine and application.

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